Syenta, a next-generation semiconductor company developing advanced packaging solutions, announced it has raised $26 million in Series A funding led by Playground Global and Australia’s National Reconstruction Fund (NRF), with participation from existing investors Investible, Salus Ventures, Jelix Ventures and Wollemi Capital. This brings the company’s total funding to date to more than $36 million. As part of the investment, Pat Gelsinger, general partner at Playground Global, will join the company’s board of directors. The funding will accelerate Syenta’s commercialization of its technology, including the company’s expansion into the United States, as it prepares for high-volume production.
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Co-founders of Syenta; Dr. Jekaterina Viktorova, CEO and Ben Wilkinson, CTO.
As AI systems scale beyond the limits of traditional chip design, performance is increasingly constrained by how efficiently chips connect and communicate, a limitation that shows up in advanced packaging. This bottleneck has become more pronounced as demand for AI and high-performance systems accelerates. At the same time, advanced packaging capacity remains concentrated in a small number of specialized facilities, creating challenges for scaling these systems.
Syenta’s proprietary Localized Electrochemical Manufacturing (LEM) technology improves AI system performance and availability by enabling high-density, chip-to-chip connections. Early results demonstrate micron-scale interconnects with meaningful improvements in bandwidth and manufacturing efficiency, resulting in 40% fewer process steps and without requiring a redesign of existing manufacturing infrastructure. By leveraging more scalable manufacturing approaches, LEM makes advanced packaging more widely accessible, helping to reduce wafer supply chain constraints. This process has been validated through industry programs, including work with leading semiconductor equipment providers.
“Today’s advanced packaging approaches have real limits on interconnect density, which constrain the bandwidth between chips,” said Dr. Jekaterina Viktorova, CEO and founder of Syenta. “We’re enabling finer-pitch connections within existing manufacturing infrastructure, allowing systems to move more data more efficiently and at a lower cost without requiring entirely new fabrication approaches.”
“This is a new way of building high-performance systems at unprecedented scale and power, particularly as AI workloads continue to grow,” said Pat Gelsinger, general partner at Playground Global. “AI’s next scaling challenge isn’t just compute, it’s how chips connect. What’s compelling about Syenta is that the company is tackling a key constraint in advanced packaging and contributing to the expansion of a more resilient global semiconductor ecosystem.”
“Syenta exemplifies the type of globally competitive, high-impact innovation the NRF was created to support,” said Dr. Mary Manning, chief investment officer, NRF. “By advancing next-generation packaging technologies, Syenta strengthens Australia’s role in critical supply chains while contributing to global semiconductor resilience.”
Industry leaders across the semiconductor ecosystem are increasingly pointing to advanced packaging as a key constraint in scaling next-generation systems.
“AI is driving unprecedented demand for heterogeneous, panel-scale systems. These systems—often composed of hundreds of chiplets—require continued innovation in packaging architectures to increase interconnect bandwidth while improving energy efficiency,” said Deepak Kulkarni, senior fellow, AMD.
This investment brings together partners across the United States and Australia to accelerate the deployment of Syenta’s technology. As it moves to commercialization, Syenta is establishing a U.S. presence in Arizona positioning the company closer to leading semiconductor customers and advanced packaging initiatives. This expansion will enable closer collaboration with customers and manufacturing partners while supporting the growth of the U.S. semiconductor ecosystem and strengthening supply chain resilience.
About Syenta
Syenta is a next-generation semiconductor company with a mission to accelerate AI computing through advanced semiconductor packaging technology. Born out of pioneering research at the Australian National University, the company has developed a breakthrough approach to chip-to-chip connectivity that pushes the boundaries of advanced packaging capabilities and enables higher performance, more scalable systems. Headquartered in Australia, the company operates globally with teams across Australia, Europe and the United States. Learn more at www.syenta.com
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